
Next-generation chips for fabless and product companies
We bring advanced 3D IC design and packaging expertise to your silicon, from architecture to integration.
- 3D IC
- Chiplets
- Advanced packaging
We help fabless and product companies design next-generation chips, and we turn fresh graduates into job-ready VLSI professionals.
Founded by engineers with 16+ years of semiconductor industry experience, we operate on two fronts.

We bring advanced 3D IC design and packaging expertise to your silicon, from architecture to integration.

Industry-standard EDA tools, real industry projects and mentorship from engineers who design chips every day.
We've worked on real chips, real tapeouts and real deadlines, and watched the industry move from planar 2D designs to today's chiplet-era architectures.
Colleges teach theory.
The industry demands skills.
BhavCore bridges the gap.
Every year, thousands of electronics graduates dream of a chip design career. We make them job-ready.
Simulate, synthesise and sign off with the tools real design teams use.
Build what the industry builds, from a UART to a pipelined RISC-V core.

Learn from engineers who have real tapeouts behind them.
Five kinds of companies bring every chip to life. Our consulting and training focus on design and advanced packaging.





Five stops and six specialisation lines. Every line ends at a job-ready VLSI engineer.
Job-oriented programmes for graduates, and advanced corporate programmes for working engineers and teams.

The complete RTL-to-GDSII flow on open-source PDKs. One design, taken through every stage of a real chip.

Hands-on sessions for engineering colleges, students and faculty, led by engineers who design real chips.
From your first logic gate to a pipelined RISC-V processor. Every project is designed, simulated and verified.

Adders, multipliers, FSMs, counters, memories and controllers. One die on this wafer for every project.

Short, practical articles on chip design, advanced packaging and VLSI careers.
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